The demand for electronic components is increasing globally at a rapid pace. This is somewhat due to the global demand growing in the ICT market for smartphones and other devices, and the dramatic growth in the markets for smart automobiles, industrial machinery, energy, and infrastructure. Also driving the global demand is the advancement in Internet of Things (IoT) applications. Consequently, the role played by electronic components in technological innovations has risen like never before.
It is predicted by some that the Internet of Things (IoT) will add tens of billions of new nodes or units on the Internet. The new units will include sensors, data storage devices, computers, and infrastructure. IoTs will let them all interact with each other and be integrated into software systems and networks. The growth creates new component opportunities and challenges within new IoT applications.
IoT applications are emerging into the market that are going to likely to require less expensive connections that do not require batteries and can withstand shock, heat, cold, radiation, and other environmental extremes. There are now IoTs that help create a “Smart Environment” by detecting forest fires, air pollution, snow levels, earthquakes, or landslides. Each of these has high performance application requirements so that the IoT can withstand the harsh environments. The components placed in these applications must be thoroughly evaluated to make sure they are up to the challenge.
Long Battery Life:
Many new IoT applications have no source of power, which makes power management3 a key issue in IoT devices. As more features are integrated onto a single system-on-ship (SoC), the amount of integrated memory also increases. By 2017, integrated memory, much of it SRAM, will consume more than 70% of a SoC’s active area. The new generation of smart watches, led by Apple, has a recharging cycle measured in hours. It’s clear that future wearables must deliver user functionality measured in days and weeks, not hours. Some ideas to address this is employing embedded SRAMs or incorporating the lowest level of hibernation to full-on high performance operations.
IoT applications will not always be in geographically concentrated locations like households. When trying to connect in rural areas it can become very challenging or expensive to fix. Companies like Tego Inc. have created passive UHF tags that are a cost effective alternative for wide range applications. This wireless passive can cache updateable product history data, making data available at the point of use, as well as aggregating it in cloud databases for analysis. Oil pipes, aircraft components, prosthetic components, and containers of blood can be interrogated by simple scanners, wherever they are.
All smart, connected products share three core elements: physical components (such as mechanical and electrical parts), smart components (sensors, microprocessors, data storage, controls, software, an embedded operating system, and a digital user interface), and connectivity components (ports, antennae, protocols, and networks that enable communication between the product and the product cloud, which runs on remote servers and contains the product’s external operating system). This 3-parts infrastructure brings extraordinary new product capabilities.
Advanced MP Technology is ready and resourceful to help with any electronic component need. With over a billion components in our regional logistic centers around the world we can help our customers better plan their component needs and avoid a line down situation.